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PCB Assembly Capabilities Prototype SMT Assembly - Components are mounted by placing them directly onto the PCB's surface. We have the capabilities to assemble.

SMT prototype PCBs in small production runs with manual and/or automated SMT production processes, including single- or double-sided component insertions.

Our production facilities can assemble the following SMT Types:

• Ball Grid Array (BGA)
• Ultra-Fine Ball Grid Array (uBGA)
• Quad Flat Pack No-Lead (QFN)
• Quad Flat Package (QFP)
• Small Outline Integrated Circuit (SOIC)
• Plastic Leaded Chip Carrier (PLCC)
• Package-On-Package (PoP)
• Small Chip Packages (pitch of 0.2 mm)